On the effect of KIRKENDALL voids on solder joint reliability
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چکیده
A model for the theoretical description of KIRKENDALL voiding is presented based on vacancy diffusion and plastic deformation of spherical voids. We start with a phenomenological explanation of the KIRKENDALL phenomenon and discuss its consequences on microelectronic reliability. After that a constitutive model for void growth is introduced, which, for instances, can be used in order to predict the temporal development of a certain void distribution. We end this paper with exemplary numerical studies.
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تاریخ انتشار 2008